| 주요논문 (최근 5년간) |
- A study on factors influencing thermal-cycling-induced passivation damages in semiconductor devices assembled utilizing a multi-chip package technique, Seong-Min Lee and Kyung-Yol Yon, J. Mech. Sci. Tech., Vol.40, No.6, pp.4431-4438 (2026)
Experimental Analysis and Theoretical Estimation to Address Filler-induced damage in Semiconductor Devices under Thermal Cycling Conditions, Seong-Min Lee and Kyung-Yol Yon, Korean J. Met. Mater., Vol. 64, No. 3 pp.1-8 (2026)
Vertically interconnected network of graphene fluoride for highly thermoconductive and electrically insulating epoxy composites, Nhat Anh Thi Thieu, Dineshkumar Nani, Jong Chan Won, Kyung-Yol Yon, Minh Canh Vu, Sung-Ryong Kim, Polymer composites, 8050p~8059p, Vol 43, Issue 11, November 2022
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